CC BY
6ALT'22
LM-O-6
LASER-MATTER INTERACTION
Direct writing of conductive patterns with pulsed near-IR laser irradiation
of deep eutectic solvents
D.A. Sinev1, E.A. Avilova1, E.A. Eltysheva1, M.A.Zaikina1, E.M. KhairuHinau, A.Yu.Shishov2, I.I.Tumkin2
1 - ITMO University, 197101 St. Petersburg, Russia 2 - Saint Petersburg State University, 199034 St. Petersburg, Russia
The laser-induced deposition method is a powerful tool for providing the localized metallization of flexible and rigid dielectric materials for the purposes of functional materials engineering, surface modification, electronics, and sensory applications. Direct laser writing of conductive micropatterns was recently improved by implementation of the eutectic solvents, that are characterized by an increased thermal and yielding efficiency of the copper reduction chemical reaction [1-2].
The experiments on the formation of conductive elements by laser-induced copper deposition were carried out in this work in an eutectic solvent medium with the composition of copper (II) acetate 2 g, choline chloride 1 g, tartaric acid 1.07 g. In this study we show the ways of forming conductive structures of an arbitrary topology by means of a single exposure using near-infrared radiation at speeds of up to 2 mm/s (Figure 1). The productivity increasing methods are discussed, including the pre-preparation of the substrate by the laser-induced microplasma [3], multiple exposure patterning, and usage of an auxiliary cover glass.
Fig.1. (a-c) The continuous -coating recording scheme, (d) optical and (e) scanning electron microphotography, and (f) EDX analysis of the recorded coating structure. (g) Photo and (h) recording scheme for the structures
of arbitrary topology [2].
I.I.T. and E.M.K. acknowledge the Russian Science Foundation's (grant 20-79-10075) support for the design of chemical compositions for the selective metallization and laser fabrication ofpatterns. D.A.S. and E.A.A. acknowledge the Russian Science Foundation's (grant 21-79-10241) support for direct laser recording, surface structuring, and LIPSSs formation studies.
[1] A.S. Levshakova, E.M. Khairullina, L.S. Logunov, M.S. Panov, A.S. Mereshchenko, V.B. Sosnovsky, D.I. Gordeychuk, A.Yu. Shishov, I.I. Tumkin, Highly rapid direct laser fabrication of Ni micropatterns for enzyme-free sensing applications using deep eutectic solvent, Materials Letters, vol. 308, Part A, pp. 131085 (2022).
[2] E.A. Avilova, E.M. Khairullina, A.Yu. Shishov, E.A. Eltysheva, V. Mikhailovskii, D.A. Sinev, I.I. Tumkin, Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation, Nanomaterials, vol. 12, pp.1127 (2022).
[3] V.S. Rymkevich, M.M. Sergeev, R.A. Zakoldaev, Laser microplasma as a spot tool for glass processing: Focusing conditions, J. Mater. Process. Technol., vol. 292, pp. 117061 (2021).
