CC BY
21LM-P-4
Laser direct writing technique for creation of metallic micropatterns in deep eutectic solvents
Andrey Shishov1, Dmitry Gordeychuk1, Lev Logunov2, Aleksandra Levshakova1, Elena Danilova1, Maxim Panov1, Evgeniia Khairullina1, Ilya Tumkin1*
1 -Institute of Chemistry, Saint Petersburg State University, SPbSU, 7/9 Universitetskaya nab., St. Petersburg
199034, Russia
2 - School of Physics and Engineering, ITMO University, Lomonosova, 9, Saint-Petersburg, 191002, Russia
Main author email address: [email protected]
The development of new technologies useful for manufacturing metallic electrically conductive structures on various dielectric substrates is necessary to create not only standard electrical circuits, but also to create flexible electronics, sensors, and other modern devices [1]. We propose to significantly improve the LCLD method [2] by using deep eutectic solvents. DESs are a mixture of the donor and acceptor of hydrogen bond, the formation of which leads to a significant decrease in the melting point of the entire system [3]. Here we studied the influence of various physical and chemical parameters on the process of laser-induced copper deposition performed from deep eutectic solvents. In our opinion, the proposed approach is rather promising for fabrication of various conductive structures based on copper and other metals. We prepared DESs based on choline chloride, glycerol, urea, ethylene glycol and five acids (citric, tartaric, malonic, oxalic and succinic).
laser beam
Fig 1. Dependence of the width and morphology of the copper line on the irradiation power and laser scanning speed.
We determined the optimal laser power (1000-1500 mW) and scanning speed (1-20 ^m min-1), which are necessary to produce conductive copper microstructures. We also studied the influence of the chemical nature of DES components on the copper deposition process. It was shown that one two of the main parameters affecting the efficiency and reproducibility of the discussed approach is are the reducing ability of the acid used and the adhesion of DES toward the substrate surface.
Acknowledgements
I.I.T., M.S.P., L.S.L. and E.M.K., acknowledge the financial support by RFBR, project number 20-3370277. This research was partially supported by Fellowship of President of Russia MK-1521.2020.3. The authors express their gratitude to the SPbSU Nanotechnology Interdisciplinary Centre, Centre for Optical and Laser Materials Research, Centre for X-ray Difraction Studies and Nanophotonics Centre.
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