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19For citation: Zhou Cong, Chai Xuhui, Mei Shunq, Burial Lygdenov. Research on Optimization of Process Parameters of Electroless Nickel Plating Based on Orthogonal Test //
URL: http://rectors.altstu.rU/ru/periodical/archiv/2022/1/articles/5_6.pdf DOI: 10.25712/ASTU.2410-485X.2022.01.015 EDN: https://elibrary.ru/jvqurg
UDK 669.248
Research on Optimization of Process Parameters of Electroless Nickel Plating Based on Orthogonal Test
Zhou Cong1, Chai Xuhui1, Mei Shunqi1,2, Burial Lygdenov1,2,3
1 School of Mechanical Engineering and Automation, Wuhan Textile University, Wuhan, 430073, China; 2 School of Mechanical & Electrical Engineering, Xi'an Polytechnic University, Xi'an, 710048, China; 3 East-Siberian State University of Technology and Management, Ulan-Ude, 670013, Russia Email: meishunqi@vip.sina.com ; lygdenov59@mail.ru
1
^m [1-3]. te^m
mm (NÍ-P) M№№#ttt£.
tt^m ní-P m^^Mtt, ^ttMft, Mttm^ffi^^^ttm^s^Mm^^^
mwrn, m
(M®, PH mftnmfcn, w^mrn^mm^,
M^^M^, [5].
PH mmm, m
2
GCr15 15mmX 15mmX5mm. fáMttB — —
mpfcmfc — — ^te — Mm — ^^hZSM. 180 #,
320#, 600#, 1000# M^fSWfA 80°C
5mín, 10mín, ^ÍE®«
a 20%HCI mm^rnm 1mm. mfflrn 1
mi.
Tab.1. Chemical plating bath composition and process conditions table
Basic formula_ _Technological condition
Components Content (g/L)
NÍSO46H2O 25
Influence factor Parameter
PH 4.4~5.6
Basic formula
Components Content (g/L)
NaH2PO2-H2O 25~40
СбИ807 И20 5
C3H6O3 15~30
NaC2H3O23H2O 15
H2NCSNH2 0.001
Technological condition
Influence factor Parameter
Temperature/°C 87
Time/min 60
з штжшФтшя.штъ
0.3-0.45
^од 25g/L, гшжттттшмгшшштш,
15ml-30ml PH fèfeft 4.4-5.6 [6-7].
шш, PH ш^етж, ш^ЙЖИЖ^ L16 (43) ^«мт 2.
МШПШШ^^ШМ^Ш*, Ш OLYMPUS-DSX-HRUF
тшмшшш, тшттш, адж^шшта, ш HV1000 шкм
m 2. ik^rnm-P ш^шшж^ш
Tab. 2. Electroless Ni-P Orthogonal Factor Level Table
H* A B C
n (Ni2+/H2PO2-) (ml/L) PH Ш
1 0.35 15 4.4
2 0.40 20 4.8
3 0.45 25 5.2
4 0.50 30 5.6
4 шжт
Tab. 3. Orthogonal experiment result table
H* A B C (^m/h) МШШЙ (HV0.1)
1 0.35 15 4.4 4.506 332.517
2 0.35 20 4.8 5.545 372.210
3 0.35 25 5.2 3.639 310.46
4 0.35 30 5.6 32.756 663.017
5 0.40 25 5.6 3.812 356.567
6 0.40 30 5.2 4.679 389.09
7 0.40 15 4.8 31.712 699.637
8 0.40 20 4.4 24.954 662.827
9 0.45 30 4.8 25.127 616.6
10 0.45 25 4.4 20.968 634.72
11 0.45 20 5.6 17.85 646.48
12 0.45 15 5.2 30.153 703.207
13 0.50 20 5.2 27.555 722.42
14 0.50 15 5.6 5.025 371.023
15 0.50 30 4.4 0 218.227
16 0.50 25 4.8 24.781 641.427
Ш 1. ttf^Ä
Figure 1. Electroless plating solution, sample and metallographic diagram
шж, ттжшптытттшш 4 m^, ki, k2, k3, k4 ш
шшшшъ R. шшшжш
Ki ж^^й^ж^, щшшшш
A3B2C2, 0.45, %Ш: 20mL/L, PH
ш 4.8. тшшш, шттштпи, A шаддаэ
жш r мх, штттьь в (%тх с (PH ш юмет. ШМ, тжт
ш i * a) шм^тшш ш ь) Ш
^мй^шетта^^йшш; d) шшщттж
С) ЮШШ^ШШт ШШИк
; e) гаш^ш&кшт^тшдаш, Ni-p шм, ^штж
m 4. шшшмшш
Tab. 4. Orthogonal experiment range analysis table
A B C
ki 11.611 17.849 12.607
k2 16.289 18.976 21.791
k3 23.524 13.3 16.506
(p,m/h) k4 14.34 15.64 14.861
11.913 5.676 9.184
A3 B2 C2
ki 417.051 526.596 462.073
k2 527.030 600.984 582.468
ШШШ. k3 650.252 485.793 531.294
(HV0.1) k4 488.274 469.233 506.772
233.201 131.751 120.395
A3 B2 C2
т 2 А^/Жшш^, м, PH шшж, щ
м
Щ, Ш^А 0.45 B, ШШ^МШЪШ^Ш 23.5^m/h ^ 650.2HVo.i ВВШ
АШ. Й^ЙАШЬШ^А^Ш^ Ni2+ ЙЩ^Ж^М^ШТ,
М PH ШШп, ЖЖ^ ШМЭДШ^АШ'МШЩ, й^ЙА PH Ш
m 2. xik/asju^js^tt, % m, ph I^II, mmm^m
Figure 2. Influence of main salt/reducing agent molar ratio, lactic acid and PH value on plating rate and microhardness
5 ^j
L16 (43)
tt, ILMtt, PH Шт7№ ШЙ: 0.45, ?LM 20ml/L,
PH Ш: 4.8, ЖАТШШЖМШЯЖА 23.5^m/h, МШША 650.2HVo.i,
[1] &Ш, Л^ШШ^ЙМД^МЙЩ [J]. ШШЙ^, 2017, 46(12):104-109. D01:10.16490/j.cnki.issn.1001-3660.2017.12.018.
[2] ЗШ^, ^«'J^M^M^M [J]. , 2022, 43(01):51-54. D0I:10.16410/j.issn1000-8365.2022.01.010.
[3] ШжШ, ШШ. [J]. ЛХШ+Шй, 2021, 47(12):76-77.
[4] а^. Л^ШШ - & - [D]. ШХ^*^, 2020. D0I:10.27322/d.cnki.gsgyu.2020.000297.
[5] [D]. ЯШ4йт 2021. D0I:10.27704/d.cnki.ghnkj.2021.000062.
[6] х^ш, мт, мшг^шш^хгж^ [J]. шшх^тш,
2018, 18(04):30-34.
[7] &Ш, лШШ, ШШ, [J]. ш ^ХХ2, 2018, 47(12):96-99+103. D0I:10.14158/j.cnki.1001-3814.2018.12.025.
