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2Photonic elements with nonclassical sources of light fabricated by
two-photon lithography
D.A. Kolymagin1*, A.V. Gritsienko1'2, N.S. Kurochkin1'2, A.I. Prokhodtsov13, A.G. Vitukhnovsky12
1-Moscow Institute of Physics and Technology (national research university), Institutsky lane, 9, 141700,
Dolgoprudny, Russia 2- Lebedev Physical Institute RAS, Leninsky Prospekt 53, 119991, Moscow, Russia 3- National University of Science and Technology "MISiS", 119049, Moscow, Russia
Among of advanced additive 3D printing techniques variety, two-photon lithography (TPL) uniquely offers a significant advantage of submicron resolution [1]. This advantage allows to fabricate elements and devices on a micro scale for various applications. Such resolution of TPL in all 3 dimensions is possible due to the nonlinear two photon absorption (TPA) effect. Because of TPA photopolymerization occurs only in near the focal spot (Figure 1). The 3D-microstructure is obtained through femtosecond focused laser beam scanning of the substrate and subsequent development process. The 3D printed structures can also act as mold to pattern other materials into structures with high resolution, as many categories of materials are not suitable to be directly fabricated with TPL.
Laser
Uncured resist
Threshold
Absorption
Fig.1: Schematic illustration of TPL process.
Photonics and quantum photonics are fast-growing fields, that were evolving from laser development and miniaturization of all optical components. However, one of the problems is connection of photonic elements and integration quantum elements in devices. Photonic wire bonding (PWB) is an exact example of a 3D laser polymerization technology transfer to solve on-a-chip integration challenges for micro-lasers couple to waveguides and optical circuits. Moreover, nonclassical light sources could be integrated into PWB structures [2]. Such approach could to provide high effective method of fabrication quantum photonics integral circuits.
In this work we reported the fabrication of PWB elements on silicon photonic chips and optical fibers for chip-to-fiber and chip-to-chip coupling. The total loss for these elements less than 5 dB. Also the integration of microdiamonds with NV centers was shown. Such integration improves the signal to noise ratio for NV center luminescence at 632 nm.
Study of 3D microstructures in combination with sources of single (Fock) photons was supported by the Russian Science Foundation project No. 22-19-00324. The fabrication of photonic elements and investigation of morphology and transmission was supported by the Russian Science Foundation project No. 22-79-10153. The technical support was partly financial from Ministry of Science and Higher Education of Russian Federation in the framework of Agreement #075-03-2024-117/8 -May 23, 2024.
[1] A. Camposeo, L. Persano, M. Farsari, D. Pisignano, Additive manufacturing: applications and directions in photonics and optoelectronics, Advanced optical materials, vol. 7, №1, 1800419, (2019).
[2] A.W. Schell, et al, Three-dimensional quantum photonic elements based on single nitrogen vacancy-centres in laser-written microstructures, Scientific reports, vol. 3, 1477, (2013).
