Научная статья на тему 'Method in vacuum to align and bond precision opto-mechanical components required for space applications'

Method in vacuum to align and bond precision opto-mechanical components required for space applications Текст научной статьи по специальности «Медицинские технологии»

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Текст научной работы на тему «Method in vacuum to align and bond precision opto-mechanical components required for space applications»

HiLASE-PS-3

Method in vacuum to align and bond precision opto-mechanical components required for space applications

S. Priya1, P. Ribes Pleguezuelo1, T. Boh1, S. Wendt1, M. Mohaupt1, E. Beckert1, E. Wille2, M. Bavdaz2, A. Tunnermann1

1Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Precision Engineering, Jena, Germany

2European Space Agency - ESA/ESTEC, Optics, Noordwijk, Netherlands

The assembling of space optical devices working in X-ray or UV-optic regimes can only be validated in similar to working vacuum conditions. The intention of the work is to develop an in vacuum assembling technique able to align and robustly bond optical components required for space missions.

In order to prove the concept, we adapted the laser soldering technique Solderjet Bumping to be operational in vacuum conditions. This low-stress soldering technique has been previously used to assemble optical space devices, but has never before been implemented under vacuum conditions. Finite-Element-Method (FEM) analysis, assembling campaigns in air and in vacuum conditions and mechanical and thermal environmental tests in final assembles are being carried out to prove that the laser assembling technique can provide a solution for the assemble of future space telescopes or similar opto-mechanical setups required for space missions.

Moreover, the vacuum alignment and bonding solder technique of test samples is compared to the application of space qualified epoxies.

Keywords: Solderjet Bumping, space optics, Laser based soldering, X-ray and UV telescopes.

Fig. 1. Schematic of the laser soldering technique Solderjet Bumping, mounted inside a vacuum chamber where thanks to a hexapod device, we are able to bond test samples (10-5 mbar vacuum regime).

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