CC BY
2The 30th International Conference on Advanced Laser Technologies
ALT'23
LM-O-9
Laser deposition of electrically conductive structures from a deep eu-
tectic solvent on dielectric substrates
D. Shestakov1, L. Logunov2
1- Department of Physical Electronics and Technology, Saint Petersburg Electrotechnical University "LETI",
197376 Saint Petersburg, Russia
2- School of Physics and Engineering, ITMO University, Lomonosova, 9, Saint- Petersburg, 191002, Russia
Main author email address: [email protected]
Local metallization of dielectrics is an important practical task; inkjet and laser sintering have been developed in industry today. Inkject printing allows to obtain very low electrical resistance by using Ag-based inks, but it requires high-precision equipment and post-processing (annealing), moreover it has speed limitation of printing and high cost of ink.[1].
The second method is laser sintering, this method is the simplest compared to others. Nanoparticles are sintered on the surface by laser action. The characteristics of the resulting structures depend on the laser parameters (power, scanning speed, focal spot diameter, etc.) and on deposited films containing nanoparticles. This method makes it possible to obtain conductors with low resistivity, but requires the preliminary synthesis of nanoparticles and ink creation, and substrate covering with thin film formation of inks [2]. We investigate laser induced chemical deposition method, it is a promising way to template-free metallization methods. The method makes it possible to create metal structures locally on the surface in the zone of laser radiation focus. The advantages of the method include simplicity, low consumption of reagents, the ability to control the shape and size of structures by an optical scheme, low cost of reagents, and environmental friendliness. The maximum scanning speed was 18 mm/s with a resistivity 0.5 Q mm2/m. We have developed a new method for obtaining thin films of deep eutectic solutions, which made it possible to achieve such results
[3].
In this work, we have created films for various applications, such as: a heating element, a transparent conductive electrode, a large solid film, high-precision electrical circuit (Fig. 1).
Fig 1. Examples of various applications Cu films.
Acknowledgments
This work was done with the financial support of the Russian Science Foundation (Project No. 390313)
[1] Beedasy, V., & Smith, P. J. (2020). Printed electronics as prepared by inkjet printing. Materials, 13(3), 704.
[2] Gao, D., & Zhou, J. G. (2019). Designs and applications of electrohydrodynamic 3D printing. International journal ofbioprinting, 5(1).
[3] Shestakov, D. S., Shishov, A. Y., Mesh, M. V., Tumkin, I. I., Makarov, S. V., & Logunov, L. S. (2022). Copper Grid/ITO Transparent Electrodes Prepared by Laser Induced Deposition for Multifunctional Optoelectronic Devices. Bulletin of the Russian Academy of Sciences: Physics, 86(1), S201-S206.
